Singapore, Singapore

Chieh Ying Heah

This inventor holds 1 USPTO granted patent. Top assignee: Dow Global Technolgoies LLC. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chieh Ying Heah. Retrieved from https://idiyas.com/inventor/chieh-ying-heah

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 11.0

ph-index = 1


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations by Chieh Ying Heah

Introduction

Chieh Ying Heah is a notable inventor based in Singapore, recognized for his contributions to the field of polymeric compositions. He has developed innovative solutions that enhance the performance of wire and cable constructions.

Latest Patents

Chieh Ying Heah holds a patent for "Moisture-cured wire and cable constructions." This invention involves articles made from a moisture-crosslinkable, polymeric composition that includes a nonpolar ethylenic polymer grafted with silane functionality. The composition is designed to exhibit desirable properties such as silane grafting efficiency, hot creep performance, retained dielectric strength, and crush resistance.

Career Highlights

He is currently associated with Dow Global Technologies LLC, where he applies his expertise in developing advanced materials. His work focuses on enhancing the durability and performance of cable constructions through innovative polymer technologies.

Collaborations

Chieh Ying Heah has collaborated with notable colleagues, including Bharat Indu Chaudhary and Manish Talreja, to further advance research and development in his field.

Conclusion

Chieh Ying Heah's innovative contributions to moisture-cured wire and cable constructions demonstrate his commitment to advancing polymer technology. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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