This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Wistron Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chieh-hsiang Lin and a Substrate Handling Invention.
Introduction
Chieh-hsiang Lin is an inventor associated with Wistron Corporation in New Taipei, Taiwan. His listed patent work focuses on a tool for securely picking up substrates with through holes.
Latest Patents
Lin is credited with 1 patent: “Substrate Pickup Tool, Substrate Assembly Station and Substrate Installation Method.” The invention describes a gripper frame fitted with a flexible gripper. Its annular mount supports multiple claw portions that move to press their outer contact surfaces against the inner wall of a substrate’s through hole. This arrangement is designed to hold and handle the substrate during pickup and installation.
Career Highlights
The available information identifies Lin’s work with Wistron Corporation and highlights his contribution to substrate handling technology. The patent combines a flexible gripping structure with a method and station for substrate installation.
Collaborations
Lin’s listed company affiliation is Wistron Corporation. The provided information does not identify specific co-inventors or other collaborators for the patent.
Conclusion
Chieh-hsiang Lin’s patent presents a flexible, through-hole gripping approach for substrate pickup and installation, reflecting his documented innovation work associated with Wistron Corporation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile