Company Filing History:
Years Active: 2000-2003
Title: Innovations of Chiang-Han Day in Semiconductor Packaging
Introduction
Chiang-Han Day is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on innovative methods that enhance the efficiency and reliability of semiconductor devices.
Latest Patents
Chiang-Han Day's latest patents include a one-step bumping/bonding method for forming semiconductor packages. This method involves aligning a first electronic substrate with a second electronic substrate, where solder balls or solder paste are applied to create electrical connections after a solder reflow process. His second patent is for a flip-chip ball grid array package that features a metal heat slug bonded to a semiconductor chip. This design not only protects the chip but also aids in heat dissipation, ensuring the longevity and performance of the semiconductor device.
Career Highlights
Chiang-Han Day is affiliated with the Industrial Technology Research Institute, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing packaging techniques that are crucial for modern electronics.
Collaborations
He has collaborated with notable colleagues such as Rong-Shen Lee and Hsing-Seng Wang, contributing to a dynamic research environment that fosters innovation.
Conclusion
Chiang-Han Day's contributions to semiconductor packaging through his patents reflect his expertise and commitment to advancing technology in this critical field. His innovative methods are paving the way for more efficient and reliable electronic devices.