Company Filing History:
Years Active: 2018-2022
Title: Innovations of Chia Yun Hsu
Introduction
Chia Yun Hsu is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 4 patents. His work focuses on advanced semiconductor package structures and optical packages, showcasing his expertise in innovative manufacturing methods.
Latest Patents
Chia Yun Hsu's latest patents include groundbreaking inventions in semiconductor packaging. One of his notable patents is a semiconductor package structure that features a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. This innovative design allows the electronic device to have an optical structure on its surface, enhancing its functionality. Another significant patent is an optical package that comprises a substrate, an image sensor, a microlens, an optical filter layer, a constraining layer, and a buffer layer. This optical package is designed to optimize the performance of image sensors through the careful arrangement of materials with varying Young's moduli.
Career Highlights
Chia Yun Hsu is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing new methods for manufacturing semiconductor packages that improve efficiency and performance.
Collaborations
Chia Yun Hsu collaborates with talented individuals in his field, including Ying-Chung Chen and Hsin-Ying Ho. These partnerships enhance the innovative capabilities of their projects and contribute to the advancement of semiconductor technology.
Conclusion
Chia Yun Hsu is a distinguished inventor whose work in semiconductor packaging and optical technology has led to multiple patents. His contributions are vital to the ongoing evolution of the semiconductor industry, and his innovative spirit continues to inspire future advancements.