Gueishan, Taiwan

Chia-Wei Liao

This inventor holds 1 USPTO granted patent. Top assignee: Speed Tech Corporation. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Wei Liao. Retrieved from https://idiyas.com/inventor/chia-wei-liao-33ecmfd7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Innovations of Chia-Wei Liao in Mobile Device Technology.

Introduction

Chia-Wei Liao is a notable inventor based in Gueishan, Taiwan. He has made significant contributions to the field of mobile device technology. His innovative designs have led to advancements that enhance user experience and functionality in mobile devices.

Latest Patents

Chia-Wei Liao holds a patent for a "Handset sliding structure." This invention provides a unique sliding mechanism for mobile devices, comprising a cover, a base, and a slider. The design features two opposing sliding tracks on the base, allowing the cover to slide smoothly. The slider includes an elastic member that ensures the cover can automatically move to a predetermined end position for opening or closing.

Career Highlights

Chia-Wei Liao is currently associated with Speed Tech Corporation, where he continues to innovate in mobile technology. His work has been instrumental in developing user-friendly mobile devices that cater to modern needs.

Collaborations

Chia-Wei has collaborated with talented coworkers such as Cheng-Sung Li and Li-Sen Chen. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Chia-Wei Liao's contributions to mobile device technology through his innovative patents demonstrate his commitment to enhancing user experience. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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