Company Filing History:
Years Active: 2023
Title: Chia-Sheng Tien: Innovator in Electronic Device Packaging
Introduction
Chia-Sheng Tien is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electronic device packaging. His innovative approach has led to the development of a unique electronic device package that enhances the functionality and reliability of electronic components.
Latest Patents
Chia-Sheng Tien holds a patent for an "Electronic device package and method of manufacturing the same." This invention includes an encapsulated electronic component, a substrate, a conductor, and a buffer layer. The encapsulated electronic component features a redistribution layer (RDL) and an encapsulation layer. The design ensures that the first surface is closer to the RDL than the second surface. The encapsulation layer consists of a first surface and a second surface opposite to it. The substrate is positioned on the second surface of the encapsulation layer, while the conductor is located between the substrate and the encapsulated electronic component, establishing an electrical connection. Additionally, the buffer layer is situated between the substrate and the encapsulated electronic component, surrounding the conductor. Chia-Sheng Tien has 1 patent to his name.
Career Highlights
Chia-Sheng Tien is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in the semiconductor industry. His work focuses on improving electronic device packaging, which is crucial for the advancement of modern electronics.
Collaborations
Chia-Sheng Tien collaborates with talented colleagues, including Chia-Pin Chen and Wan-Ting Chiu. Their combined expertise contributes to the success of their projects and the advancement of technology in their field.
Conclusion
Chia-Sheng Tien is a prominent inventor whose work in electronic device packaging has made a significant impact on the industry. His innovative patent demonstrates his commitment to enhancing electronic components. His contributions will continue to influence the future of technology.