Shulin, Taiwan

Chia-Ming Cheng

This inventor holds 1 USPTO granted patent. Top assignee: Portwell Inc.. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Ming Cheng. Retrieved from https://idiyas.com/inventor/chia-ming-cheng-73m0xn8o

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Chia-Ming Cheng

Introduction

Chia-Ming Cheng is a notable inventor based in Shulin, Taiwan. He has made significant contributions to the field of technology, particularly in the design of heat dissipating structures for dual CPU systems. His innovative approach has led to the development of a patent that enhances the efficiency of computer devices.

Latest Patents

Cheng holds a patent for a "Dual CPU and heat dissipating structure thereof." This invention focuses on a heat dissipating module that is installed on a dual-CPU computer device. The design allows CPUs to be arranged alternately on a motherboard, with heat dissipating modules positioned at the CPU locations. This arrangement prevents interference from external cold air and effectively conducts heat away from the CPUs, ensuring optimal performance and preventing overheating.

Career Highlights

Chia-Ming Cheng is currently employed at Portwell Inc., where he continues to innovate and develop advanced technological solutions. His work has been instrumental in improving the thermal management of computer systems, which is crucial for maintaining performance and reliability.

Collaborations

Cheng collaborates with Hui-Hsuan Chuang, contributing to the advancement of their projects and enhancing the overall innovation process within their company.

Conclusion

Chia-Ming Cheng's contributions to the field of technology, particularly through his patented designs, demonstrate his commitment to innovation and excellence. His work not only improves the functionality of computer systems but also sets a standard for future developments in thermal management.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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