Company Filing History:
Years Active: 2019-2022
Title: Chia-Ling Pai: Innovator in Chemical Mechanical Polishing Processes
Introduction
Chia-Ling Pai is a notable inventor based in Santa Clara, CA, who has made significant contributions to the field of chemical mechanical polishing. With a total of two patents to her name, she has demonstrated her expertise and innovation in developing advanced methods and apparatus for enhancing polishing processes.
Latest Patents
Chia-Ling Pai's latest patents focus on methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes. One of her patents discloses a retaining ring that includes a body comprising an upper portion and a lower portion. The lower portion features a sacrificial surface that comprises a negative tapered surface with a taper height ranging from about 0.0003 inches to about 0.00015 inches. This innovative design aims to improve the efficiency and effectiveness of polishing processes.
Career Highlights
Chia-Ling Pai is currently employed at Applied Materials, Inc., where she continues to push the boundaries of innovation in her field. Her work has been instrumental in advancing the technology used in chemical mechanical polishing, which is critical for the semiconductor industry.
Collaborations
Chia-Ling has collaborated with notable coworkers, including David Masayuki Ishikawa and Jeonghoon Oh, contributing to a dynamic and innovative work environment.
Conclusion
Chia-Ling Pai's contributions to the field of chemical mechanical polishing through her patents and work at Applied Materials, Inc. highlight her role as a leading inventor in this specialized area. Her innovative designs and methods continue to influence the industry positively.