Chia-Jung Liu

Title: Innovations of Chia-Jung Liu in High-Speed Signal Testing

Introduction

Chia-Jung Liu is an accomplished inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of high-speed signal transmission, particularly in the design of probe assemblies for testing printed circuit boards. His innovative approach addresses critical challenges in signal integrity and bandwidth efficiency.

Latest Patents

Chia-Jung Liu holds a patent for a probe assembly that is specifically designed to test high-speed signal transmission lines of printed circuit boards. This assembly includes two pogo pins that provide high-frequency differential test signals. Notably, both sides of the pogo pins are devoid of a metal layer, which helps to mitigate issues related to radiation resonance. Experiments have demonstrated that when the pogo pins test a target object, the test signal can couple to the metal layers adjacent to the pogo pins, leading to a loss of signal at specific frequency bands. By reducing the metal layers on both sides of the pogo pins, Liu's design effectively avoids this radiation resonance phenomenon, thereby enhancing the effective bandwidth of the probe assembly. He has been granted 1 patent for this innovative solution.

Career Highlights

Chia-Jung Liu is currently employed at Mpi Corporation, where he continues to develop cutting-edge technologies in the field of electronics. His work has been instrumental in advancing the capabilities of testing equipment used in high-speed applications.

Collaborations

Chia-Jung Liu collaborates with talented colleagues, including Ming-Hsiang Hsieh and Chia-Nan Chou, to further enhance the research and development efforts at Mpi Corporation.

Conclusion

Chia-Jung Liu's contributions to the field of high-speed signal testing exemplify the importance of innovation in technology. His patented probe assembly represents a significant advancement in ensuring signal integrity and bandwidth efficiency in electronic testing.