Taipei, Taiwan

Chia-Jen Wen

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Textile Research Institute. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Jen Wen. Retrieved from https://idiyas.com/inventor/chia-jen-wen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Chia-Jen Wen: Innovator in Hydrogel Microparticle Technology

Introduction

Chia-Jen Wen is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of hydrogel microparticle technology. His innovative work has led to the development of a unique hydrogel microparticle composition.

Latest Patents

Chia-Jen Wen holds a patent for a hydrogel microparticle composition, which includes a method for preparing the same. The patent describes a process that involves creating a dispersion with specific components, including N-isopropyl acrylamide and chitosan, among others. This method allows for the production of hydrogel microparticles that can be utilized in various applications.

Career Highlights

Chia-Jen Wen is affiliated with the Taiwan Textile Research Institute, where he continues to advance research in textile and material sciences. His work has garnered attention for its potential applications in various industries.

Collaborations

Chia-Jen Wen has collaborated with notable colleagues, including Yu-Chun Hung and Chi-Shu Wei. These partnerships have contributed to the advancement of research and innovation in their respective fields.

Conclusion

Chia-Jen Wen's contributions to hydrogel microparticle technology exemplify the spirit of innovation. His work not only enhances scientific understanding but also paves the way for future advancements in material science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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