Chia-Jen Lee

Title: Innovations of Chia-Jen Lee in Wrapper Testing Circuits

Introduction

Chia-Jen Lee is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuits, particularly in the area of wrapper testing circuits. His innovative work has led to advancements that enhance the efficiency of electrical tests in system-on-a-chip designs.

Latest Patents

Chia-Jen Lee holds 1 patent for his invention titled "Wrapper testing circuits and method thereof for system-on-a-chip." This patent describes a wrapper testing circuit designed for electrical tests of at least a core circuit of an integrated circuit. The invention includes a controller that outputs control signals and test signals while receiving result signals executed by the core circuit. The wrapper testing circuit features decoding logic and multiple wrapper boundary registers. The decoding logic utilizes a signal decoding table to receive and decode control signals, issuing decoded signals accordingly. The wrapper boundary registers shift, update, and capture test signals for the core circuit, ultimately improving testing time compared to prior art.

Career Highlights

Chia-Jen Lee is affiliated with the Industrial Technology Research Institute, where he continues to work on innovative solutions in the field of technology. His expertise in integrated circuits and testing methodologies has positioned him as a valuable asset in his organization.

Collaborations

Chia-Jen Lee has collaborated with notable colleagues such as Yeong-Jar Chang and Wen-Ching Wu. Their combined efforts contribute to the advancement of technology and innovation in their respective fields.

Conclusion

Chia-Jen Lee's contributions to wrapper testing circuits exemplify the importance of innovation in integrated circuit technology. His work not only enhances testing efficiency but also sets a foundation for future advancements in the industry.