Chia-Hung Lin

Title: Chia-Hung Lin: Innovator in Semiconductor Packaging

Introduction

Chia-Hung Lin is a prominent inventor based in Hukou, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of packaging methods. His innovative approach has led to the development of a unique stacked semiconductor package that enhances reliability and performance.

Latest Patents

Chia-Hung Lin holds a patent for a "Stacked Semiconductor Package and Packaging Method Thereof." This invention features a substrate, a first chip, at least one spacer, a second chip, and an encapsulation. The design allows the first and second chips to be intersecting and stacked on the substrate, with spacers providing support for the second chip. The encapsulation is designed to cover the entire assembly, ensuring enhanced adhesion between the spacer and encapsulation, which prevents delamination during reliability tests. This innovation significantly improves the reliability of semiconductor packages.

Career Highlights

Chia-Hung Lin is currently employed at Powertech Technology Inc., a leading company in semiconductor packaging and testing. His work at Powertech has positioned him as a key player in advancing semiconductor technologies. With a focus on innovation, he continues to contribute to the company's success and the broader industry.

Collaborations

Chia-Hung Lin collaborates with talented colleagues, including Yin-Huang Kung and Fu-Yuan Yao. Their combined expertise fosters a creative environment that drives innovation in semiconductor packaging.

Conclusion

Chia-Hung Lin's contributions to semiconductor packaging technology exemplify the importance of innovation in the electronics industry. His patented methods enhance the reliability of semiconductor packages, showcasing his commitment to advancing technology.