Chia-Hui Lin

Title: Chia-Hui Lin and Fan-Out Stacked Packaging

Introduction

Chia-Hui Lin is an inventor associated with Shengang Township, Taiwan, and Taiwan Semiconductor Manufacturing Co., Ltd. The available information credits Lin with 1 patent, concerning advanced semiconductor packaging.

Latest Patents

Lin’s listed patent, “Fan-out stacked package and methods of making the same,” describes a package architecture that stacks devices and dies using redistribution structures and encapsulants. In one embodiment, a first and second device are attached to a redistribution structure. The second device incorporates multiple redistribution structures, two dies, encapsulants along the dies’ sidewalls, and a via connecting metallization patterns. The dies are free of through-substrate vias, while an additional encapsulant surrounds the devices and has a top surface level with the second encapsulant. The design outlines a way to integrate stacked components and electrical connections within a fan-out package.

Career Highlights

The available data associates Lin with Taiwan Semiconductor Manufacturing Co., Ltd., a semiconductor company. The listed patent reflects work on packaging methods for integrating multiple dies and redistribution structures.

Collaborations

Shih-Peng Tai is identified as Lin’s coworker. The provided information does not specify Tai’s role in the patent or describe any particular collaboration.

Conclusion

Chia-Hui Lin’s listed patent focuses on fan-out stacked packaging, combining multiple dies, redistribution structures, and encapsulation in a design that avoids through-substrate vias in the dies.