Taipei, Taiwan

Chia-Hsien Wei

This inventor holds 1 USPTO granted patent. Top assignee: Hongbo Wireless Communication Technology Co., Ltd.. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Hsien Wei. Retrieved from https://idiyas.com/inventor/chia-hsien-wei

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Chia-Hsien Wei: Innovator in Wireless Communication Technology

Introduction

Chia-Hsien Wei is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of wireless communication technology. His innovative work has led to the development of a unique patent that enhances electronic devices.

Latest Patents

Chia-Hsien Wei holds a patent for a "System of integrated module with antenna." This system is designed for electronic devices and includes a circuit board, at least one antenna exciting unit, a wireless module, a module grounding plane, a grounding metal, a camera module, and a digital signal line. The antenna exciting unit couples with an antenna, while the wireless and camera modules are integrated onto the circuit board. This design allows for efficient communication and functionality within electronic devices.

Career Highlights

Chia-Hsien Wei is currently employed at Hongbo Wireless Communication Technology Co., Ltd. His role at the company allows him to apply his expertise in developing advanced wireless communication solutions. His innovative approach has positioned him as a key player in the industry.

Collaborations

Chia-Hsien Wei has collaborated with talented coworkers, including Tsung-Wen Chiu and Yao-Yuan Chang. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Chia-Hsien Wei's contributions to wireless communication technology exemplify the spirit of innovation. His patent for an integrated module with antenna showcases his ability to enhance electronic devices. His work continues to influence the field and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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