Location History:
- Taipei, TW (2007 - 2011)
- Taipei Hsien, TW (2007 - 2013)
- Hsichih, TW (2013)
- New Taipei, TW (2013 - 2014)
Company Filing History:
Years Active: 2007-2014
Title: Innovations by Chia-Hsien Lee in Soldering Technology
Introduction
Chia-Hsien Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of soldering technology, holding a total of 11 patents. His work focuses on improving the efficiency and effectiveness of soldering components onto circuit boards.
Latest Patents
One of his latest patents is a soldering system designed for soldering a dual in-line package (DIP) component onto a circuit board. This innovative system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. The design features at least one hole in the shelter, which corresponds to the shape and dimensions of the DIP component. The transmission roller rotates the shelter based on the track's transmission speed. The position sensor detects the circuit board's position relative to the boiler, while the thermal radiation heating device heats a specific area on the second surface of the circuit board, enhancing the soldering process.
Another notable patent involves a method for soldering a DIP component onto a circuit board. This method includes piercing the DIP component through the circuit board, applying fluxer, and passing the first surface of the circuit board through a boiler. Molten tin flows between the DIP component and the circuit board through the first surface, while the second surface is heated to increase its temperature, ensuring a successful soldering process.
Career Highlights
Chia-Hsien Lee is currently employed at Wistron Corporation, where he continues to innovate in the field of soldering technology. His expertise and dedication have led to advancements that benefit the electronics manufacturing industry.
Collaborations
He has collaborated with notable coworkers, including Hao-Chun Hsieh and Chu-Chia Tsai, contributing to various projects that enhance soldering techniques and technologies.
Conclusion
Chia-Hsien Lee's contributions to soldering technology through his innovative patents demonstrate his commitment to advancing the field. His work not only improves manufacturing processes but also sets a standard for future developments in electronics.