Wistron Corporation

Chia-Hsien Lee

Hao-Chun Hsieh

Chu-Chia Tsai

Wen-Chin Wu

Kuo-Kun Lin

Hsin-Lun Tsai

Jun-Min Yang

Kun-Shan Lee

Chun-I Teng

Hsien-Min Chen

A soldering system includes a track, a laying device, a boiler, a shelter, a transmission roller, a position sensor, a thermal radiation heating device, and a driving device. At least one hole is formed on the shelter, and a shape and a dimension of at least one hole on the shelter corresponds to a shape and a dimension of a DIP component. The transmission roller rotates the shelter according to a transmission speed of the track. The position sensor detects a position of a circuit board relative to the boiler. The thermal radiation heating device heats an area on a second surface of the circuit board different from a first surface adjacent to the DIP component through the at least one hole on the shelter continuously, so as to increase a temperature of the second surface when the first surface of the circuit board is passing through the boiler.

Soldering system of soldering a dip component on a circuit board

A method of soldering a DIP component on a circuit board includes piercing the DIP component through the circuit board, laying fluxer on the circuit board, passing a first surface of the circuit board through a boiler so that molten tin from the boiler flows between the DIP component and the circuit board through the first surface of the circuit board, and heating a second surface of the circuit board different from the first surface so as to increase temperature of the second surface by a thermal radiation heating device to when the first surface of the circuit board passes through the boiler.

Method and soldering system of soldering a DIP component on a circuit board

A method for assembling components on a circuit board includes driving the circuit board to an assembling position after the circuit board is moved in a first direction and then is blocked at a positioning point by a positioning rod, assembling a first component set on a first region of the circuit board when the circuit board is positioned in the assembling position, folding the positioning rod, driving the circuit board back to the positioning point after the first component set has been assembled on the first region of the circuit board, driving the circuit board in the first direction until the positioning rod moves to an end of a slot on the circuit board, driving the circuit board to the assembling position again, and assembling a second component set on a second region of the circuit board when the circuit board is positioned in the assembling position.

Method for assembling components on a circuit board

A clamping tool for rework process includes a casing, two clamping members and a thermal expansion member. The casing has a base. The two clamping members are pivotally connected to the casing and located at opposite sides of the base. The thermal expansion member is disposed in the casing and located over the base. The thermal expansion member is capable of expanding by heat so as to push the two clamping members to rotate with respect to each other.

Clamping tool and equipment for rework process

A metal shielding can includes a top wall and a surrounding wall. The surrounding wall extends downwardly from a periphery of the top wall, and includes a bottom surface and a groove formed in the bottom surface for receiving a tin solder element. The strength of the tin solder element to bond the metal shielding can to a circuit board can thus be enhanced so that the metal shielding can can be secured firmly on the circuit board. Moreover, the tin solder element can be positioned accurately relative to a solder pad of the circuit board, so that the post-soldering precision is easy to control and there is no solder overflow or adverse effect on an electronic component mounted on the circuit board. Thus, rework yield can be enhanced considerably to reduce manufacturing costs.

Metal shielding can and assembly of the metal shielding can and a circuit board

An auxiliary mechanism to be attached to a portable electronic device when capturing image data of an image medium, the portable electronic device includes an image capture element, the auxiliary mechanism comprises a body, a fixer and a connecting element. The fixer is connected to the body, wherein the image medium is placed on the fixer. The connecting element is connected to the body and detachably connected to the portable electronic device, wherein the image capture element corresponds to the image medium and captures the image data thereof.

Auxiliary mechanism

A circuit board assembling system includes a circuit board whereon a slot is formed. The circuit board includes a first region and a second region. The circuit board assembling system further includes a component placement machine, a positioning rod, wherein a first width of the unadjusted positioning rod is larger than a width of the slot so that the unadjusted positioning rod can not pass through the slot, a conveying device for driving the circuit board to a positioning point in a first direction and driving the circuit board to an assembling position in a second direction, and a control unit for controlling the conveying device to drive the circuit board to the assembling position in the second direction and controlling the component placement machine to assemble a first component set and a second component set on the first region and the second region respectively.

System for assembling components on a circuit board

A heat conducting apparatus includes an air guide hood and a heat conducting device. The air guide hood is connected to a hot air supply source for delivering hot air, and includes an air outlet for exit of the hot air. The heat conducting device is disposed at the air outlet of the air guide hood, and includes a contact wall spaced apart from and disposed below the air outlet for contacting a soldered component, and a surrounding wall extending upwardly from the contact wall and connected to the air guide hood. The contact wall and the surrounding wall cooperatively define a space for guiding the hot air. The contact wall conducts the heat to the soldered component so as to melt tin solders between the soldered component and a circuit board, thereby reducing any adverse effect on other electronic components or good chips on the circuit board.

Heat conducting apparatus and solder melting method therefor

This invention provides an expansion socket for a digital video device, which is located under a side of a housing of the digital video device in a laptop. By configuring the expansion socket and the digital video device, it may form a box-like shape. The expansion socket for the digital video device of this invention comprises a socket main body for an expansion module to be inserted into in order to increase the functionality of the laptop.

Expansion socket for digital video devices

A mini PCI module includes a mini PCI card and a mini PCI slot for the mini PCI card to be inserted into. The mini PCI card includes 124 signal pins and an antenna pin set. The mini PCI slot includes 124 signal connection ends corresponding to the 124 signal pins, and an antenna connection end set corresponding to the antenna pin set for electrically connecting to an antenna set.

Growing community of inventors

Taipei, Taiwan

Chia-Hsien Lee