Taipei, Taiwan

Chia-Chien Chen

This inventor holds 3 USPTO granted patents. Top assignee: Tymphany Hk Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Chien Chen. Retrieved from https://idiyas.com/inventor/chia-chien-chen-7su5p1kx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.4

ph-index = 1


Company Filing History:


Years Active: 2026

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3 patents (USPTO):Explore Patents

Title: Chia-Chien Chen: Innovator in Diaphragm Assembly and Vibration Module Technologies

Introduction

Chia-Chien Chen is an inventor based in Taipei City, Taiwan. He has made significant contributions to the field of diaphragm assembly and vibration module technologies. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

Chia-Chien Chen's recent patent applications include two notable inventions. The first is a diaphragm assembly, along with a method of manufacturing it and an injection mold. This invention provides a diaphragm assembly that includes a cone with at least one alignment feature at its peripheral edge. The manufacturing method involves aligning the cone's features with a mounting tool and forming a surround at the cone's edge.

The second application is for a vibration module, which is designed to be used in speakers. This module consists of a surround and a diaphragm. The surround features an annular convex section that connects to the diaphragm, providing a damping effect. Additionally, the surround includes a first annular portion and a second annular portion, which serve to enhance the overall functionality of the module.

Conclusion

Chia-Chien Chen is an inventive mind focused on advancing diaphragm assembly and vibration module technologies. His latest patent applications showcase his commitment to innovation in these fields.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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