This inventor holds 2 USPTO granted patents. Top assignee: Arima Computer Corporation. Active years: 2005.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2005
Title: Innovations by Chia-Chen Yu
Introduction
Chia-Chen Yu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of packaging technology, holding two patents that enhance the protection of objects during transportation. His innovative designs focus on increasing the buffering capacity of packaging solutions.
Latest Patents
Chia-Chen Yu's latest patents include a buffer packing apparatus designed for packing an object and increasing the buffering capacity between the object and a packaging box. This apparatus features a U-shaped column body and a pair of buffering sleeves. The two carrier boards within the U-shaped column body support the upper and lower surfaces of the object. The buffering sleeves are engaged at the ends of the U-shaped column body, creating a buffering space that protects the object from external impacts. Additionally, the corners of the buffer packing apparatus are chamfered to enhance the buffering capacity of the sleeves when the packaging box experiences external forces.
Another patent by Chia-Chen Yu is also a buffer packing apparatus, but this one is designed for packing multiple objects. It comprises several rectangular partition boards and buffer columns, forming compartments that accommodate and buffer the objects. The design allows for easy identification of the orientation of the objects inside the packing apparatus. With chamfers on every corner, this apparatus effectively absorbs shocks from external impacts, thereby increasing its buffering capacity.
Career Highlights
Chia-Chen Yu is currently employed at Arima Computer Corporation, where he continues to innovate in the field of packaging technology. His work has contributed to advancements in how products are protected during shipping and handling.
Collaborations
Chia-Chen Yu collaborates with his coworker, Ming-Wei Li, to further enhance their projects and drive innovation within their company.
Conclusion
Chia-Chen Yu's contributions to packaging technology through his innovative buffer packing apparatuses demonstrate his commitment to improving product safety during transportation. His work at Arima Computer Corporation continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile