Chi-young Lee

Title: Innovations by Chi-young Lee

Introduction

Chi-young Lee is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents to his name, his work focuses on enhancing the performance and reliability of semiconductor packages.

Latest Patents

Chi-young Lee's latest patents include innovative designs for semiconductor packages that incorporate warpage compensation. One of his patents describes a semiconductor package that features a substrate body with a first and second surface. A semiconductor chip is mounted on the first surface, while a plurality of electrode pads is located on the second surface. These pads are selectively formed to have progressively smaller or larger sizes, extending from a central region of the substrate body toward its outer edge. This design is based on a reflow soldering process warpage profile, which aims to improve the overall performance of the semiconductor package.

Career Highlights

Chi-young Lee is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to be at the forefront of semiconductor innovation. His contributions have been instrumental in advancing the technology used in modern electronic devices.

Collaborations

Chi-young Lee has collaborated with notable colleagues, including Heung-Kyu Kwon and Seok-Won Lee. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Chi-young Lee's work in semiconductor technology exemplifies the spirit of innovation. His patents reflect a commitment to improving the functionality and reliability of electronic components. As he continues to develop new technologies, his contributions will undoubtedly shape the future of the semiconductor industry.