Chi-Yen Lin

Title: Innovations of Chi-Yen Lin

Introduction

Chi-Yen Lin is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of temporary bonding compositions and methods. With a total of three patents to his name, Lin's work is recognized for its innovative approaches to semiconductor packaging.

Latest Patents

Chi-Yen Lin's latest patents include a temporary bonding composition, a temporary bonding film, a composite film, and a semiconductor wafer package. The temporary bonding composition he developed consists of a polyfunctional crosslinker, a polymer, and a solvent. This composition features a compound with at least two functional groups, including blocked isocyanate groups, alkenyl ether groups, and alkoxyhydrocarbyl groups. The polymer in this composition reacts with the polyfunctional crosslinker, enhancing its effectiveness. Another significant patent is the laser-debondable composition, which includes an acrylic resin, a light-shielding material, an additive, and a solvent. This composition is designed to provide excellent adhesion, attachability, and solvent resistance.

Career Highlights

Chi-Yen Lin is currently associated with Daxin Materials Corporation, where he continues to innovate in the field of materials science. His work has been instrumental in advancing technologies related to semiconductor packaging and bonding methods. Lin's expertise in developing new materials has positioned him as a key figure in his industry.

Collaborations

Chi-Yen Lin collaborates with talented individuals such as Cheng-Wei Lee and Chun-Hung Huang. These partnerships enhance the innovative capacity of their projects and contribute to the success of their endeavors.

Conclusion

Chi-Yen Lin's contributions to the field of materials science through his patents and collaborations highlight his role as a leading inventor. His work continues to influence advancements in semiconductor technology and bonding methods.