The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 07, 2020

Filed:

Apr. 24, 2019
Applicant:

Daxin Materials Corporation, Taichung, TW;

Inventors:

Chi-Yen Lin, Taichung, TW;

Cheng-Wei Lee, Taichung, TW;

Chun-Hung Huang, Taichung, TW;

Hou-Te Lu, Taichung, TW;

Yuan-Li Liao, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 179/08 (2006.01); B32B 37/12 (2006.01); B32B 43/00 (2006.01); C09J 5/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C09J 179/08 (2013.01); B32B 37/12 (2013.01); B32B 43/006 (2013.01); C09J 5/00 (2013.01); H01L 21/6836 (2013.01); B32B 2457/14 (2013.01); C09J 2205/302 (2013.01); C09J 2205/31 (2013.01); C09J 2479/08 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01);
Abstract

A method for temporary bonding workpiece includes steps as follows. A combining step is performed, wherein an adhesive layer is formed on a surface of at least one substrate and/or at least one workpiece. A bonding step is performed, wherein the substrate and the workpiece are bonded by the adhesive layer. A processing step is performed, wherein the workpiece is processed. A debonding step is performed, wherein the adhesive layer is irradiated with a laser so as to separate the workpiece from the substrate. The adhesive layer is formed by an adhesive, the adhesive includes a polymer and a light absorbing material, a content of the polymer in a solid content of the adhesive is in a range of 50 wt % to 98 wt %, a content of the light absorbing material in the solid content of the adhesive is in a range of 2 wt % to 50 wt %.


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