Company Filing History:
Years Active: 2015-2022
Title: The Innovations of Chi-Yao Kuo
Introduction
Chi-Yao Kuo is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of image sensor packages. With a total of 3 patents to his name, Kuo's work has had a substantial impact on the industry.
Latest Patents
One of Chi-Yao Kuo's latest patents involves an image sensor semiconductor package and related methods. This innovative package includes a printed circuit board (PCB) with a first surface and a second surface opposite the first surface. A complementary metal-oxide semiconductor (CMOS) image sensor (CIS) die is integrated into the design, featuring a photosensitive region on its first surface. The second surface of the CIS die is coupled with the first surface of the PCB, while a transparent cover is placed over the photosensitive region. An image signal processor (ISP) is embedded within the PCB, and various electrical couplers connect the CIS die with the PCB. The design also includes multiple electrical contacts on the PCB's second surface, ensuring efficient communication between the CIS die and the ISP.
Career Highlights
Chi-Yao Kuo is currently employed at Semiconductor Components Industries, LLC, where he continues to innovate and develop cutting-edge technologies. His expertise in semiconductor packaging has positioned him as a key player in the industry.
Collaborations
Throughout his career, Kuo has collaborated with notable colleagues, including Larry Duane Kinsman and Yusheng Lin. These partnerships have further enhanced his contributions to the field.
Conclusion
Chi-Yao Kuo's work in semiconductor technology, particularly in image sensor packages, showcases his innovative spirit and dedication to advancing the industry. His patents reflect a commitment to improving technology and enhancing the capabilities of image sensors.