The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Jul. 23, 2012
Larry D. Kinsman, Boise, ID (US);
Chi-yao Kuo, Taipei, TW;
Larry D. Kinsman, Boise, ID (US);
Chi-Yao Kuo, Taipei, TW;
Semiconductor Components Industries, LLC, Phoenix, AZ (US);
Abstract
A multi-chip package may include an image sensor chip, an image signal processor (ISP) chip, a cover glass, and a package substrate. The ISP chip may be placed on the substrate. The image sensor chip may be placed over the ISP chip. An adhesive film may be formed between the ISP and image sensor chips. A cover glass may be suspended above the image sensor chip. The ISP chip and the image sensor chip may be wire bonded to the substrate. The multi-chip package may be hermetically sealed using a liquid compound or a dam structure. During normal operation, the ISP chip sends control signals to the image sensor chip via a first set of wire bond members and conductive traces in the substrate while the image sensor chip sends output signals to the ISP chip via a second set of wire bond terminals and conductive traces in the substrate.