Hong Kong, China

Chi Shing Low

This inventor holds 1 USPTO granted patent. Top assignee: Avery Dennison Retail Information Services, LLC. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chi Shing Low. Retrieved from https://idiyas.com/inventor/chi-shing-low

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Chi Shing Low

Introduction

Chi Shing Low is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of packaging technology. With a focus on creating practical solutions, he has developed a unique patent that enhances the functionality of packaging.

Latest Patents

Chi Shing Low holds a patent for a reclosable package with vents. This innovative design allows for better ventilation and usability, making it a valuable addition to the packaging industry. His work exemplifies the intersection of creativity and practicality in product design.

Career Highlights

Chi Shing Low is currently employed at Avery Dennison Retail Information Services, LLC. His role at the company allows him to apply his inventive skills in a professional setting. With a patent portfolio that includes 1 patent, he continues to push the boundaries of packaging solutions.

Collaborations

Throughout his career, Chi has collaborated with talented individuals such as Caroline W Hughes and Jamie Kobrzycki. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Chi Shing Low is a remarkable inventor whose contributions to packaging technology are noteworthy. His innovative spirit and collaborative efforts continue to inspire advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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