Chi-po Liao

Title: The Innovative Contributions of Chi-po Liao

Introduction

Chi-po Liao is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of integrated circuit devices. His innovative methods have advanced the processing techniques used in semiconductor manufacturing.

Latest Patents

Chi-po Liao holds a patent titled "Method for repairing plasma damage after spacer formation for integrated circuit devices." This patent describes a method for processing integrated circuit memory devices. The method involves supporting a partially completed substrate that comprises a plurality of MOS gate structures. Each gate structure has substantially vertical regions that define its sides. The process includes forming a conformal dielectric layer over the gate structures, which has a predetermined thickness that covers each structure, including the vertical regions. The method also details the formation of sidewall spacers on the sides of the gate structures using an anisotropic etching process. This process exposes a portion of the substrate, potentially causing physical damage, such as plasma damage or cracks. To address this, the method smoothes the exposed portions of the sidewall spacers and substrate using a plasma treatment process that includes an isotropic etching component. This results in a predetermined surface roughness value.

Career Highlights

Chi-po Liao is associated with Semiconductor Manufacturing International Corporation, a leading company in the semiconductor industry. His work has been instrumental in enhancing the reliability and performance of integrated circuits.

Collaborations

Chi-po Liao has collaborated with notable colleagues, including Mingching Wang and Kuang-Yu Huang. Their combined expertise has contributed to advancements in semiconductor technology.

Conclusion

Chi-po Liao's innovative methods and contributions to the semiconductor industry highlight his role as a key inventor in the field. His patent on repairing plasma damage showcases his commitment to improving integrated circuit processing techniques.