Company Filing History:
Years Active: 1997-1998
Title: Innovations by Chi-jung Kang
Introduction
Chi-jung Kang is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to manufacturing processes.
Latest Patents
One of his latest patents is an "Apparatus for bonding semiconductor wafers." This invention provides a reliable method for firmly bonding semiconductor wafers to each other. The apparatus features bonding plates with grooves that reduce the bond force between the wafers and the plates, preventing the wafers from sliding off due to an air cushion. Additionally, an interval controlling pin is designed to maintain a safe distance between the bonding plates during rotation, minimizing the risk of wafer breakage. An elastic pad portion on one of the bonding plates ensures that the wafers bond properly when the plates are further rotated towards each other.
Another significant patent is the "SOI substrate manufacturing method." This method addresses the warpage in the SOI substrate by adjusting the thickness of a semiconductor material layer that is added over the bonded combination of a semiconductor substrate and a supporting substrate.
Career Highlights
Chi-jung Kang is currently employed at Samsung Electronics Co., Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has contributed to advancements in the manufacturing processes that are critical for modern electronics.
Collaborations
He has collaborated with notable colleagues such as Kyung-wook Lee and Gi-ho Cha, further enhancing the innovative environment at Samsung Electronics.
Conclusion
Chi-jung Kang's contributions to semiconductor technology through his patents reflect his commitment to innovation and excellence in the field. His work continues to influence the industry and pave the way for future advancements.