Samsung Electronics Co., Ltd.

Chi-jung Kang

Kyung-wook Lee

Gi-ho Cha

Byoung-hun Lee

Byung-hun Lee

An apparatus for bonding semiconductor wafers firmly bonds the wafers to each other and can always lay the bonded wafers on a desired bonding plate. The bonding plates have a plurality of grooves formed on their respective surfaces to reduce the bond force between the wafers and the bonding plates of the apparatus, and to prevent the wafers from sliding off the plates due to an air cushion. An interval controlling pin projects from the surface of one of the bonding plates to reduce breakage of the wafers by maintaining an interval between the bonding plates as they are are rotated towards each other. An elastic pad portion is installed on one the bonding plates for providing an elastic force for the wafers placed on the bonding plates so that the wafers bond to each other properly when the bonding plates are further rotated towards each other.

Apparatus for bonding semiconductor wafers

A SOI substrate manufacturing method which corrects the warpage in the SOI substrate by varying the thickness of a semiconductor material layer additionally formed over the bonded combination of a semiconductor substrate and supporting substrate.

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Seoul, South Korea

Chi-jung Kang