Taipei, Taiwan

Chi-Hsueh Yang

This inventor holds 3 USPTO granted patents. Top assignee: Clevo Co.. Active years: 2025-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chi-Hsueh Yang. Retrieved from https://idiyas.com/inventor/chi-hsueh-yang-i9z172za

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2025-2026

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3 patents (USPTO):Explore Patents

Title: Chi-Hsueh Yang: Innovator in Heat Dissipation Technologies

Introduction

Chi-Hsueh Yang is a prominent inventor based in Taipei, Taiwan. She has made significant contributions to the field of heat dissipation technologies, holding a total of 3 patents. Her innovative designs focus on improving the efficiency of heat management in various applications.

Latest Patents

Chi-Hsueh Yang's latest patents include a heat dissipation module and a heat dissipation structure. The heat dissipation module features a heat dissipating sheet with a first and second surface, along with a heat conduction member that is strategically placed to enhance heat management. The second surface of the heat dissipating sheet is designed to be adjacent to a heating source, ensuring effective heat dissipation. The heat dissipation structure comprises a fixation unit that surrounds a heating source, defining a hollow area with specific non-masking and masking areas to optimize heat dissipation.

Career Highlights

Chi-Hsueh Yang is currently associated with Clevo Co., a company known for its advancements in technology and innovation. Her work at Clevo Co. has allowed her to focus on developing cutting-edge solutions for heat management, contributing to the company's reputation in the industry.

Conclusion

Chi-Hsueh Yang is a trailblazer in the field of heat dissipation technologies, with her patents reflecting her commitment to innovation. Her contributions continue to influence the industry and pave the way for future advancements in thermal management solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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