Chi Hoo Wan

Title: Innovations of Chi Hoo Wan

Introduction

Chi Hoo Wan is a notable inventor based in Hong Kong, China. He has made significant contributions to the field of semiconductor technology. With a total of two patents to his name, his work reflects a commitment to advancing electronic device design.

Latest Patents

Chi Hoo Wan's latest patents include a packaged semiconductor device with interior polygonal pads. This invention features a semiconductor chip and a package structure that defines a rectangular boundary. The bottom surface of the package structure includes interior polygonal pads that are exposed and located on a centerline, as well as edge polygonal pads positioned at the edges of the rectangular boundary. The design ensures that a line running between at least one vertex of each interior polygonal pad is parallel to an edge of the package structure's rectangular boundary.

Career Highlights

Throughout his career, Chi Hoo Wan has worked with prominent companies such as NXP B.V. and Nexperia B.V. His experience in these organizations has allowed him to refine his skills and contribute to innovative projects in the semiconductor industry.

Collaborations

Chi Hoo Wan has collaborated with notable coworkers, including Roelf A. J. Groenhuis and Kan Wae Lam. These partnerships have played a crucial role in the development of his inventions.

Conclusion

Chi Hoo Wan's contributions to semiconductor technology through his patents demonstrate his innovative spirit and dedication to the field. His work continues to influence advancements in electronic device design.