Company Filing History:
Years Active: 2003
Title: The Innovative Contributions of Chi Chung Mok
Introduction
Chi Chung Mok is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding technology, particularly through his innovative patent related to wedge bonding heads. His work exemplifies the intersection of engineering and precision in modern manufacturing processes.
Latest Patents
Chi Chung Mok holds a patent for a wedge bonding head. This invention provides a bonding head for a wedge wire bonding apparatus, where the bonding force of the transducer assembly and the clamping force of the wire clamping assembly are generated by permanent magnet motors. These motors include coils that are part of both the transducer assembly and the wire clamping assembly, with the coils positioned between magnets fixed to a bond head bracket member. The use of permanent magnet motors allows for high accuracy and reliability in controlling the bonding and clamping forces.
Career Highlights
Chi Chung Mok is associated with Asm Assembly Automation Limited, where he applies his expertise in bonding technology. His innovative approach has contributed to advancements in the efficiency and effectiveness of bonding processes in the industry.
Collaborations
Some of his coworkers include Wing Cheung Ho and Gary Peter Widdowson. Their collaboration has likely fostered an environment of innovation and shared knowledge within the company.
Conclusion
Chi Chung Mok's contributions to the field of bonding technology through his patent demonstrate his commitment to innovation and precision engineering. His work continues to influence advancements in manufacturing processes.