Chi-Cheng Lin

Title: Chi-Cheng Lin: Innovator in Wafer-Level Chip Scale Packaging

Introduction

Chi-Cheng Lin is a prominent inventor based in Taoyuan Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative designs that enhance the performance and efficiency of electronic devices. His work is characterized by a focus on advanced materials and manufacturing techniques.

Latest Patents

Chi-Cheng Lin holds a patent for a wafer-level chip scale package. This invention includes a chip that features a substrate and a GaN transistor disposed on the substrate. The GaN transistor is designed with a first electrode, a dielectric layer placed on the chip, and a redistribution trace that is electrically connected to the first electrode. Notably, the redistribution trace has both a linear side and a curved side along its longitudinal direction, which contributes to its functionality and efficiency.

Career Highlights

Chi-Cheng Lin is currently employed at Delta Electronics, Inc., a leading company in the electronics industry. His role at Delta has allowed him to work on cutting-edge technologies and contribute to the development of innovative electronic solutions. His expertise in semiconductor packaging has positioned him as a valuable asset to the company.

Collaborations

Throughout his career, Chi-Cheng Lin has collaborated with notable colleagues, including Chia-Yen Lee and Hsin-Chang Tsai. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Chi-Cheng Lin's contributions to wafer-level chip scale packaging exemplify his innovative spirit and dedication to advancing technology in the electronics field. His work continues to influence the industry and pave the way for future advancements.