Chi-An Dai

Title: Chi-An Dai: Innovator in Imaging Element Cutting Technology

Introduction

Chi-An Dai is a notable inventor based in Rochester, NY (US). He has made significant contributions to the field of imaging technology, particularly through his innovative methods for cutting imaging elements. His work is recognized for its potential to enhance efficiency and reduce waste in manufacturing processes.

Latest Patents

Chi-An Dai holds a patent for a method of cutting an imaging element. This invention involves moving an imaging element through a cutting zone formed by two cutting blades. The first cutting blade has a first cutting surface and a first engaging surface, while the second cutting blade features a second cutting surface and a second engaging surface. In the cutting zone, these engaging surfaces are in contact for a distance greater than or equal to the thickness of the imaging element. The cutting surfaces are separated by a distance ranging from 1 to 30 percent of the thickness of the imaging element. This innovative method effectively reduces debris and skiving generation during the cutting process. He has 1 patent to his name.

Career Highlights

Chi-An Dai is associated with Eastman Kodak Company, where he applies his expertise in imaging technology. His work at this renowned company has allowed him to contribute to advancements in imaging processes and technologies.

Collaborations

Chi-An Dai has collaborated with notable colleagues, including Andy Haishung Tsou and Stephen C. Meissner. These collaborations have fostered innovation and development in their respective fields.

Conclusion

Chi-An Dai's contributions to imaging technology through his patented methods demonstrate his commitment to innovation and efficiency. His work continues to influence the industry and pave the way for future advancements.