Kyungki-Do, South Korea

Cheol W Kwak


Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1996

Loading Chart...
1 patent (USPTO):

Title: The Innovative Journey of Inventor Cheol W Kwak

Introduction: Cheol W Kwak, based in Kyungki-Do, South Korea, is an accomplished inventor recognized for his significant contributions in the field of semiconductor technology. With a focus on improving die attach adhesive compositions, his work has garnered attention for enhancing the performance and reliability of semiconductor packages.

Latest Patents: Cheol W Kwak holds a patent for a "Copper oxide-filled polymer die attach adhesive composition for semiconductor package." This innovative composition comprises an adhesion resin mixture and an inorganic filler, specifically incorporating copper oxide, which may include CuO or Cu2O, in an amount ranging from approximately 0.1% to 90% by weight. The composition may also optionally contain silver, which provides exceptional electric conductivity and bonding strength, overcoming challenges such as package cracking and delamination.

Career Highlights: Throughout his career, Cheol W Kwak has worked with notable companies, including Anam Industrial Co., Ltd. and Amkor Electronics, Inc. His technical expertise and inventive spirit have been crucial in developing effective adhesive solutions for the semiconductor industry, showcasing his commitment to advancing technological innovation.

Collaborations: Cheol W Kwak's collaborations with established companies in the semiconductor sector reflect his impactful contributions to the field. By partnering with organizations such as Anam Industrial and Amkor Electronics, he has been able to push the boundaries of material science and engineering, driving forward innovations in adhesive compositions for semiconductor applications.

Conclusion: As an inventor, Cheol W Kwak exemplifies the spirit of innovation and dedication to advancing technology. His patented work on copper oxide-filled polymer die attach adhesive compositions demonstrates the essential role inventors play in enhancing the performance and reliability of modern electronic devices. Through his contributions, he continues to influence the semiconductor industry and inspire future innovations.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…