Shanghai, China

Chenyi Qian

This inventor holds 1 USPTO granted patent. Top assignee: Shanghai Jiao Tong University. Active years: 2026.


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Chenyi Qian in Heat Sink Technology

Introduction

Chenyi Qian is an accomplished inventor based in Shanghai, China. He has made significant contributions to the field of thermal management through his innovative designs. His work focuses on enhancing the efficiency of heat sinks, which are critical components in various electronic devices.

Latest Patents

One of Chenyi Qian's notable patents is titled "Three-channel heat sink based on tri-continuous mesoporous silica structure and preparation method for three-channel heat sink." This invention provides a unique three-channel heat sink that utilizes a tri-continuous mesoporous silica structure. The design includes multiple three-channel porous units stacked on one another, with each unit containing three non-communicating channels. Each channel is equipped with at least one flow path, and the arrangement of flow paths is optimized to enhance thermal performance.

Career Highlights

Chenyi Qian is affiliated with Shanghai Jiao Tong University, where he continues to advance research in thermal management technologies. His innovative approach to heat sink design has garnered attention in the academic and industrial sectors. With a total of 1 patent, he is recognized for his contributions to improving the efficiency of electronic cooling systems.

Collaborations

Chenyi has collaborated with several colleagues, including Haozhang Zhong and Jiaxuan Wang, who have supported his research endeavors. Their combined expertise has contributed to the development of advanced thermal management solutions.

Conclusion

Chenyi Qian's work in heat sink technology exemplifies the importance of innovation in enhancing electronic device performance. His contributions are paving the way for more efficient thermal management solutions in the industry.

Profile summary based on public USPTO records.
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