Shanghai, China

Chenxia Feng

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021-2025

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2 patents (USPTO):Explore Patents

Title: Innovations by Chenxia Feng: Advancements in Printed Circuit Board Technology

Introduction

Chenxia Feng, an accomplished inventor based in Shanghai, China, has made significant contributions to the field of electronic engineering. With a total of two patents to his name, his innovations focus primarily on improving the design and functionality of printed circuit boards (PCBs).

Latest Patents

Chenxia's latest patents showcase his expertise in high-speed signal processing and wiring arrangements. The first patent, titled "Printed Circuit Board and Wire Arrangement Method Thereof," presents a novel method for distributing wires of a packaged chip across different board layers. This innovation enables a high-speed path from the chip to the connector through backdrilling techniques, optimizing the PCB for enhanced performance.

The second patent, "High Speed Signal Fan-Out Method for BGA and Printed Circuit Board Using the Same," further illustrates his proficiency. This method involves the strategic arrangement of vias and signal traces on a PCB to facilitate efficient signal routing. By employing back-drilled holes and arranging vias in straight lines, this technique enhances the overall signal integrity and performance of the circuit board.

Career Highlights

Chenxia Feng is currently associated with Celestica Technology Consultancy (Shanghai) Co., Ltd., where he applies his extensive knowledge in the development of cutting-edge electronic solutions. His work in this reputable firm underscores his dedication to advancing technology and innovation within the electronics sector.

Collaborations

Throughout his career, Chenxia has collaborated with notable professionals in the industry, including Jiwei Wen and Liang Chen. These collaborations have played a crucial role in driving forward innovative projects and patent development. The synergy of their collective expertise fosters an environment ripe for groundbreaking advancements.

Conclusion

In conclusion, Chenxia Feng stands out as a prominent figure in the field of electronic engineering, with his patents paving the way for advancements in printed circuit board technology. His contributions not only demonstrate ingenuity but also highlight the impact of collaboration in driving innovation. As technology continues to evolve, inventors like Chenxia will undoubtedly play an essential role in shaping the future of the electronics industry.

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