The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2021

Filed:

Dec. 28, 2018
Applicant:

Celestica Technology Consultancy (Shanghai) Co. Ltd, Shanghai, CN;

Inventors:

Jiwei Wen, Shanghai, CN;

Chenxia Feng, Shanghai, CN;

Liang Chen, Shanghai, CN;

Lijuan Qu, Shanghai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H05K 1/115 (2013.01); H05K 3/0047 (2013.01); H05K 3/043 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/09636 (2013.01); H05K 2201/09672 (2013.01); H05K 2203/0207 (2013.01);
Abstract

The present invention provides a high speed signal fan-out method for BGA and a PCB using the same. The method comprises: providing a printed circuit board (PCB), providing a plurality of vias and signal traces of the vias on the PCB; and providing back-drilled holes for routing of other signal traces at positions corresponding to the vias. The vias are arranged into a plurality of straight lines from an edge to the center of the PCB. The plurality of straight lines each is horizontal or vertical. The signal traces of the vias in a straight line are arranged from high to low or from low to high with respect to routing positions of the vias, and the back-drilled holes of the plurality of vias are arranged in descending or ascending order corresponding to the depths of the back-drilled holes.


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