Shenyang, China

Chenlong Liu

This inventor holds 1 USPTO granted patent. Top assignee: Lightyear Exploration (Jiangsu) Space Technology Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chenlong Liu. Retrieved from https://idiyas.com/inventor/chenlong-liu-bxqanuh9

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chenlong Liu: Inventor of a Von Karman Fairing Structure

Introduction

Chenlong Liu is an inventor based in Shenyang, China. His listed patent concerns a cone segment structure for a fairing, and he is associated with Lightyear Exploration (Jiangsu) Space Technology Co., Ltd.

Latest Patents

Liu’s listed patent is titled “Cone Segment Structure of Fairing with Two-Half Hood Structures Having Metal Bars Made in a Von Karman Curve Shape.” It describes a fairing cone segment formed from two half-hood structures. Each half-hood uses intersecting bus metal bars and loop metal bars, with the bus bars shaped into Von Karman curves through stretch bending. Together, the halves form a Von Karman cone segment hood covered by a skin and fitted with an end cap at the top. The supplied information lists 1 patent for Liu.

Career Highlights

The available information associates Liu with Lightyear Exploration (Jiangsu) Space Technology Co., Ltd. His listed invention focuses on the structural design and fabrication of a fairing hood.

Collaborations

Liu’s named coworkers include Lipeng Wang and Chengye Li. The supplied information does not specify their roles in the patent or their particular contributions.

Conclusion

Chenlong Liu’s listed patent presents a fairing design that combines Von Karman-shaped metal bars, paired hood structures, a skin, and an end cap.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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