Chenji Zou

Title: Chenji Zou: Innovator in Quantum Technology

Introduction

Chenji Zou is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of quantum technology, particularly in the development of qubit assemblies. His innovative work is paving the way for advancements in superconducting quantum chips.

Latest Patents

Chenji Zou holds 1 patent for his invention titled "Qubit assembly, qubit assembly preparation method, chip, and device." This patent describes a production line device that prepares a superconducting circuit layer on a substrate. The device is designed to create an under bump metallization (UBM) layer on the upper surface of the superconducting circuit layer. A superconducting connection is formed between the UBM layer and the superconducting circuit layer. Additionally, the production device prepares a welding spot on the upper surface of the UBM layer to obtain a qubit assembly configured for a flip-chip superconducting quantum chip. A superconducting electrical connection is established between the welding spot and the UBM layer.

Career Highlights

Chenji Zou is currently employed at Tencent Technology (Shenzhen) Company Limited, where he continues to work on cutting-edge technologies. His role at Tencent allows him to collaborate with other talented professionals in the field of quantum technology.

Collaborations

Some of his notable coworkers include Yarui Zheng and Hui Xing Wang. Their collective expertise contributes to the innovative environment at Tencent, fostering advancements in quantum technology.

Conclusion

Chenji Zou's contributions to the field of quantum technology, particularly through his patented inventions, highlight his role as a leading inventor in this rapidly evolving area. His work is instrumental in shaping the future of superconducting quantum chips.