This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Honor Device Co., Ltd.. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Chenji Niu and Lightweight Vapor-Chamber Technology.
Introduction
Chenji Niu is an inventor based in Shenzhen, China, associated with Honor Device Co., Ltd. His patent work includes a design for a lightweight, thin vapor chamber intended for use in mobile terminals and other electronic devices.
Latest Patents
Niu is named on 1 patent: “Mobile terminal, vapor chamber and preparation method thereof, and electronic device.” The invention describes a vapor chamber with first and second cover plates joined to form a sealed cavity, along with a cooling medium, a capillary structure, and an internal supporting structure. The cover plates use a high-strength composite material made from two material layers. The design aims to combine low weight and a small profile with structural strength.
Career Highlights
Niu’s listed patent reflects work on thermal-management components for compact electronics. The disclosed vapor chamber is designed for integration into mobile terminals and other electronic devices.
Collaborations
The patent lists Yonglu Liu and Jiaju Liu as Niu’s coworkers. The invention is associated with Honor Device Co., Ltd.
Conclusion
Chenji Niu’s patent focuses on a strong, lightweight vapor chamber that supports thermal management in mobile and other electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile