Tianjin, China

Chengwen Yang

This inventor holds 1 USPTO granted patent. Top assignee: Masterwork Machinery Co., Ltd.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chengwen Yang. Retrieved from https://idiyas.com/inventor/chengwen-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Chengwen Yang: Innovator in Die Cutting Technology

Introduction

Chengwen Yang is a notable inventor based in Tianjin, China. He has made significant contributions to the field of machinery, particularly in die cutting technology. His innovative approach has led to the development of a unique patent that enhances the efficiency of die cutting processes.

Latest Patents

Chengwen Yang holds a patent for a die cutting machine with stripping and blanking. This invention is designed to improve the functionality and productivity of die cutting operations, making it a valuable asset in the manufacturing industry.

Career Highlights

Yang is currently employed at Masterwork Machinery Co., Ltd., where he applies his expertise in machinery design and innovation. His work at this company has allowed him to further develop his skills and contribute to advancements in the industry.

Collaborations

Chengwen Yang collaborates with talented coworkers, including Yunfei Shou and Shuyuan Wei. Together, they work on various projects that aim to push the boundaries of technology in their field.

Conclusion

Chengwen Yang is a dedicated inventor whose work in die cutting technology has made a significant impact. His patent and contributions to Masterwork Machinery Co., Ltd. highlight his commitment to innovation and excellence in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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