Company Filing History:
Years Active: 2023
Title: Innovations of Chenguang Yin in Wafer-Level Chip Scale Packaging
Introduction
Chenguang Yin is a notable inventor based in JiangYin, China. He has made significant contributions to the field of semiconductor packaging. His innovative work focuses on wafer-level chip scale packaging structures, which are essential for modern electronic devices.
Latest Patents
Chenguang Yin holds a patent for a wafer-level chip scale packaging structure that includes a rewiring layer. The patent outlines a method for manufacturing this structure, which involves several key steps. These steps include providing a supporting substrate, placing a chip on the substrate, and forming a packaging layer. The process continues with separating the chip from the substrate and attaching the packaging layer to another substrate. Additionally, a rewiring layer is formed to connect the chips electrically.
Career Highlights
Chenguang Yin is currently employed at SJ Semiconductor (Jiangyin) Corporation. His work at the company has allowed him to focus on advancing semiconductor technologies. His expertise in packaging structures has positioned him as a valuable asset in the industry.
Collaborations
Chenguang collaborates with Yenheng Chen, who is also a key contributor in the field. Their partnership enhances the innovative capabilities of their projects and contributes to the success of their endeavors.
Conclusion
Chenguang Yin's contributions to wafer-level chip scale packaging represent a significant advancement in semiconductor technology. His innovative methods and collaborative efforts continue to shape the future of electronic device manufacturing.