Company Filing History:
1 out of 832,912 Years Active: 2022
Title: Innovations of Chengpeng Duan in Sedimentation Technology
Introduction
Chengpeng Duan is an accomplished inventor based in Huainan, China. He has made significant contributions to the field of sedimentation technology, particularly with his innovative designs aimed at improving efficiency in thickening processes. His work reflects a commitment to advancing engineering solutions that address practical challenges in various industries.
Latest Patents
Chengpeng Duan holds a patent for a "Multi-stage sedimentation rake-free thickening device." This device features a central tank and an outer diversion sedimentation zone, which includes an annular diversion sedimentation screen and a concentrated magnetic shower. The design incorporates an annular groove that is spirally arranged around a central groove body, with second spoiler baffles and underflow discharge ports strategically placed to enhance sedimentation efficiency. The innovative structure allows for effective water discharge through a second overflow discharge pipe, showcasing his ingenuity in engineering design.
Career Highlights
Throughout his career, Chengpeng Duan has focused on developing technologies that improve sedimentation processes. His patent demonstrates his ability to create practical solutions that can be applied in various industrial settings. His work has garnered attention for its potential to enhance operational efficiency and reduce costs in sedimentation applications.
Collaborations
Chengpeng Duan has collaborated with notable colleagues, including Chao Wang and Erning Zhao. These partnerships have likely contributed to the development and refinement of his innovative technologies, fostering a collaborative environment that encourages the exchange of ideas and expertise.
Conclusion
Chengpeng Duan's contributions to sedimentation technology through his patented innovations highlight his role as a forward-thinking inventor. His work not only addresses current challenges in the field but also paves the way for future advancements in engineering solutions.