Shenzhen, China

Chenglong Ma

This inventor holds 1 USPTO granted patent. Top assignee: Huawei Digital Power Technologies Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chenglong Ma. Retrieved from https://idiyas.com/inventor/chenglong-ma-9cjkqh4r

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Chenglong Ma: Power Electronics Inventor in Shenzhen

Introduction

Chenglong Ma is an inventor based in Shenzhen, China. His patent work concerns magnetic components and power electronics, including an inductor designed for use in power factor correction and power supply systems.

Latest Patents

Ma is associated with 1 patent, titled “Inductor, Power Factor Correction Circuit, and Power Supply System.” The invention describes an inductor with a coil winding and a magnetic core. The core has two outer magnetic sections positioned opposite each other, with a winding unit between them and the coil wound around that unit. The winding unit includes a middle magnetic column and at least two air gaps distributed along the direction between the outer sections.

The design is intended to improve the operating efficiency of a power factor correction circuit and help optimize power supply system efficiency under light loads.

Career Highlights

Ma is associated with Huawei Digital Power Technologies Co., Ltd. His patent reflects work on power conversion components and efficiency improvements in power supply systems.

Collaborations

Jun Wang and Shaolei Chen are identified as Ma’s coworkers. Their names are also associated with the professional context provided for his work.

Conclusion

Chenglong Ma’s patent focuses on an inductor design intended to support more efficient power factor correction and power supply operation, particularly during light-load conditions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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