Company Filing History:
Years Active: 2021-2023
Title: Innovations by Inventor Chenglong Dai
Introduction: Chenglong Dai is a notable inventor based in Shanghai, China, recognized for his contributions to the field of glass technology. With a total of two patents to his name, Dai has made significant strides in the development of specialized glass substrates that enhance optical properties in various applications.
Latest Patents: One of Chenglong Dai’s latest patents focuses on the creation of textured glass for light extraction enhancement in OLED lighting. This invention involves a textured glass substrate that retains the mechanical and optical properties of standard glass, offering a cost-effective and scalable method for producing glass suitable for organic light-emitting diode structures. His second patent addresses the creation of low sparkle anti-glare glass-based articles, employing innovative methods to reduce warp in anti-glare glass. This process involves etching both surfaces of the glass article to create distinct anti-glare features while minimizing warping to maintain quality over larger dimensions.
Career Highlights: Chenglong Dai is currently employed at Corning Incorporated, a leader in materials science, where he continues to innovate and develop new glass technologies. His industrial experience and academic background contribute to his effectiveness as an inventor, ensuring that his ideas are both practical and pioneering.
Collaborations: In his endeavors, Chenglong Dai has collaborated with colleagues such as Haixing Chen and Ling Chen. These collaborations have played a vital role in refining his ideas and bringing innovative glass products to fruition.
Conclusion: As an inventor, Chenglong Dai exemplifies ingenuity and forward-thinking in the realm of glass technology. His patents not only enhance the performance of existing lighting solutions but also contribute to the ongoing evolution of anti-glare materials. With continued support from his company and colleagues, Dai’s future endeavors are likely to yield even more groundbreaking innovations in the field.