Nanjing, China

Chengjun Liu

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Micromotion Gmbh. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chengjun Liu. Retrieved from https://idiyas.com/inventor/chengjun-liu-lkkoo79o

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Chengjun Liu: Innovator in Capacitive Touch Sensor Technology

Introduction

Chengjun Liu is a prominent inventor based in Nanjing, China. He has made significant contributions to the field of touch sensor technology. His innovative work has led to the development of a capacitive touch sensor that enhances user interaction with electronic devices.

Latest Patents

Chengjun Liu holds a patent for a capacitive touch sensor. This sensor includes an electrode positioned between a plate and a spring. The spring exerts pressure on the electrode towards the plate, aligning it parallel to the longitudinal length of the spring. The electrode features a flat sensing surface that is parallel with the plate, allowing for precise touch detection.

Career Highlights

Chengjun Liu is currently employed at Micromotion GmbH, where he continues to advance his research and development efforts. His work at the company focuses on improving touch sensor technologies, which are essential in various electronic applications.

Collaborations

Chengjun Liu collaborates with talented coworkers, including Mei Zhang and Heng Zhao. Their combined expertise fosters a creative environment that drives innovation in their projects.

Conclusion

Chengjun Liu's contributions to capacitive touch sensor technology exemplify his dedication to innovation. His work not only enhances user experience but also sets the stage for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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