Shenzhen, China

Chengfang Xiao

This inventor holds 1 USPTO granted patent. Top assignee: Shenzhen Snapmaker Technologies Co., Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chengfang Xiao. Retrieved from https://idiyas.com/inventor/chengfang-xiao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Chengfang Xiao - Innovator in 3D Printing Technology

Chengfang Xiao is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of 3D printing technology. His innovative work has led to the development of a patent that enhances the functionality and design of 3D printers.

Latest Patents

Chengfang Xiao holds a patent for a three-dimensional printer housing. This invention is designed to improve the structural integrity and usability of 3D printers. His patent is a testament to his commitment to advancing technology in this rapidly evolving field. He has 1 patent to his name, showcasing his innovative capabilities.

Career Highlights

Chengfang Xiao is currently employed at Shenzhen Snapmaker Technologies Co., Ltd. This company is known for its cutting-edge advancements in 3D printing and related technologies. His role at Snapmaker allows him to work on innovative projects that push the boundaries of what is possible in 3D printing.

Collaborations

Chengfang collaborates with Xuedong Chen, a fellow innovator in the field. Their partnership exemplifies the spirit of teamwork and shared vision in technological advancements.

Conclusion

Chengfang Xiao is a prominent figure in the 3D printing industry, with a focus on innovative designs and technologies. His contributions are paving the way for future advancements in this exciting field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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