Company Filing History:
Years Active: 2017
Title: Cheng-Yu Yang: Innovator in Semiconductor Packaging
Introduction
Cheng-Yu Yang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and solutions. His work is particularly recognized for enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
Cheng-Yu Yang holds a patent for a semiconductor package that includes a first chip, an insulating protection layer, a second chip, a plurality of second conductive bumps, and an underfill. The insulating protection layer is strategically placed on the first active surface of the first chip and features a concave design. Projections of a plurality of first inner pads and a plurality of first outer pads of the first chip are located in and out of the concave, respectively. The second chip is flipped onto the concave and includes a plurality of second pads. Each of the first inner pads is electrically connected to the corresponding second pad through the corresponding second conductive bump. The underfill is positioned between the concave and the second chip, covering the second conductive bumps. This innovative design enhances the performance and durability of semiconductor packages.
Career Highlights
Cheng-Yu Yang is currently employed at Chipmos Technologies Inc., a leading company in the semiconductor industry. His role involves developing advanced packaging solutions that meet the growing demands of modern electronics. His contributions have been instrumental in driving the company's success in the competitive semiconductor market.
Collaborations
Cheng-Yu Yang has collaborated with his coworker, Cheng-Yi Weng, to further enhance their research and development efforts in semiconductor technology. Their teamwork has led to innovative solutions that benefit the industry.
Conclusion
Cheng-Yu Yang is a notable inventor whose work in semiconductor packaging has made a significant impact on the industry. His innovative designs and collaborative efforts continue to push the boundaries of technology, contributing to advancements in electronic devices.