Company Filing History:
Years Active: 2015-2016
Title: Cheng-Wen Chiu: Innovator in Packaging Substrate Technology
Introduction
Cheng-Wen Chiu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of packaging substrate technology, holding a total of 2 patents. His innovative methods have advanced the fabrication processes used in the electronics industry.
Latest Patents
Chiu's latest patents include a "Fabrication method of packaging substrate" and "Packaging substrate and fabrication method thereof." Both patents describe a method for fabricating a packaging substrate that involves providing a carrier with a first metal layer and a second metal layer. The process includes forming a first circuit layer on the second metal layer and creating a separating portion on the edge of the second metal layer. This method ensures that the integrity of the first circuit layer is maintained during the removal of the first metal layer and the carrier.
Career Highlights
Cheng-Wen Chiu is currently employed at Siliconware Precision Industries Co., Ltd. His work at this leading company has allowed him to focus on innovative solutions in packaging technology. His contributions have been instrumental in enhancing the efficiency and reliability of electronic components.
Collaborations
Chiu has collaborated with notable colleagues such as Wei-Ping Wang and Pang-Chun Lin. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Cheng-Wen Chiu is a key figure in the advancement of packaging substrate technology. His patents reflect his commitment to innovation and excellence in the field. His work continues to influence the electronics industry positively.