Company Filing History:
Years Active: 2018-2022
Title: Innovations of Cheng-Ping Lee in Chemical Mechanical Polishing
Introduction
Cheng-Ping Lee is a notable inventor based in Miaoli County, Taiwan. He has made significant contributions to the field of chemical mechanical polishing, holding a total of 11 patents. His work focuses on improving the processes and compositions used in polishing substrates, particularly those containing tungsten and titanium.
Latest Patents
Cheng-Ping Lee's latest patents include a method for chemical mechanical polishing a substrate containing tungsten and titanium. This innovative process involves providing a polishing composition that includes water, an oxidizing agent, chitosan, a dicarboxylic acid, a source of iron ions, and a colloidal silica abrasive. The method ensures that tungsten is polished away from the substrate with a selectivity relative to titanium. Another significant patent involves a polishing composition that utilizes select quaternary phosphonium compounds at low concentrations to reduce the corrosion rate of tungsten during the polishing process.
Career Highlights
Cheng-Ping Lee is currently associated with Rohm and Haas Electronic Materials CMP Holdings, Inc. His expertise in chemical mechanical polishing has positioned him as a key figure in the development of advanced polishing techniques and materials.
Collaborations
Cheng-Ping Lee has collaborated with notable coworkers such as Wei-Wen Tsai and Lin-Chen Ho. Their combined efforts have contributed to the advancement of polishing technologies in the semiconductor industry.
Conclusion
Cheng-Ping Lee's innovative work in chemical mechanical polishing has led to significant advancements in the field. His patents reflect a commitment to improving substrate polishing processes, making him a valuable contributor to the industry.
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