Hsinchu, Taiwan

Cheng-Nan Lin

USPTO Granted Patents = 4 

Average Co-Inventor Count = 5.6

ph-index = 1


Company Filing History:


Years Active: 2022-2025

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4 patents (USPTO):

Title: A Spotlight on Inventor Cheng-Nan Lin

Introduction

Cheng-Nan Lin, an innovative inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor technology. With three patents to his name, Lin's work focuses on advancing semiconductor devices and their manufacturing processes.

Latest Patents

Lin's most recent patents include groundbreaking technologies related to semiconductor devices and packages. One of his notable inventions describes a semiconductor device that comprises a substrate, an interconnect structure, and conductive vias. The substrate features a unique design with a first side, a second side, and a sidewall that connects the two sides. This sidewall includes a first planar sidewall from one portion, a second planar sidewall from another portion, and a curved sidewall from a third section, facilitating efficient connections between components. The interconnect structure is strategically located on the first side of the substrate, while the conductive vias are placed on this structure, allowing for enhanced connectivity and performance.

Career Highlights

Cheng-Nan Lin is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., a leader in the semiconductor industry. His expertise and innovative approach have significantly impacted the development of advanced semiconductor technologies, positioning him as a key player in this competitive field.

Collaborations

Lin collaborates closely with esteemed colleagues, including Chang-Jung Hsueh and Wan-Yu Chiang. Together, they work on innovative projects aimed at pushing the boundaries of semiconductor research and development, contributing valuable insights and advancements to the industry.

Conclusion

Cheng-Nan Lin exemplifies the spirit of innovation in the semiconductor field, with a focus on enhancing device efficiency and manufacturing processes. His contributions, through both individual patents and collaborative efforts, continue to shape the future of technology and set new standards in semiconductor advancements.

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